The conductive composites of polyaniline (Pani) and epoxy resin were prepared by polymerization of aniline in the presence of epoxy resin, using a direct, one step in situ polymerization method. The polymerization of aniline was performed in an emulsion system comprising water and toluene containing epoxy resin in the presence of dodecylbenzene sulfonic acid, which acts as surfactant and a dopant for Pani. The electrical conductivity of Pani/ epoxy resin reached values as high as 2 x 10-3 S/cm at a Pani content corresponding of 7 wt% of Pani. The Pani content in the mixtures was calculated by means of elemental analysis. The relationships between glass transition temperature (Tg) and Pani.DBSA content obtained by two different cured methods were also investigated.
Polyaniline; conducting composites; electrical conductivity; epoxy resin
